Solder Paste 15g for PCB/SMD/BGA/PGA
Solder Paste for repairing electronic boards, PCs, Laptops, Smartphones, playstation, Satellite Receiver and all sensitive electronic appliances by using tin soldering iron, hot air soldering station and SMT/BGA rework station.
Specifications:
- Particle Size:30-45 Micron
- Alloy: Sn63/Pb37
- Melting Point: 185-240 Celsius
Features:
- Suitable to stencil printing (holes larger than 0.45mm).
- Good conductivity and oxidation resistance.
- High purity and soft soldering.
- Bright and full solder joints.
- No residue solid after rework and easy cleaning.
- Halogen free.
Usage:
- Repairing electronic boards such as PCB/SMD/BGA/PGA for PCs, Laptops, Smartphones, playstation, Satellite Receiver and all sensitive electronic appliances.
- Reballing BGA chipset with reballing stencil (holes larger than 0.45mm).
- Repairing phones, as well as replacement SMD component, micro switches and charging connectors.
- Soldering electrical control boards.
- Soldering all copper alloys, wires, lithium ion batteries and solderable surfaces as nickel strips.
Usage Recommendations (very important):
- Follow safety precautions & notes.
- Clean the surface (Clear any residues or dust).
- Put a very little bit of solder paste before soldering.
- Use a suitable soldering iron tip with the target area.
- Use a suitable soldering iron with the target size.
- Use a suitable soldering station with the target component.
- Use a wet soldering sponge for cleaning the tip and during soldering.
- Use thinner or any alcohol for cleaning.
Notes:
- For best results, follow the usage recommendations.
- Don’t put soldering iron tip in the solder paste.
- Not suitable with welding by fusion or flame.
Safety Precautions:
- Close after using & keep away from children.
- Use enough water when eyes or wounds are touched.
Appearance:
The solder paste is a soft paste, packaged in a round plastic can -net weight 15g.
