ReWork SMT/BGA Liquid Flux 125mL
For repairing (SMT/BGA) chipset solder balls, soldering and reballing of chipset for PCs, laptops, smartphones and all sensitive electronic components by using tin soldering iron, hot air soldering station and SMT/BGA rework station.
Features:
- Quick repairing of oxidized solder balls for chipset without lifting.
- Fast reflow and evenly spread under (BGA) chipset.
- High quality and activity.
- Non conductive, non corrosive and fungus resistant.
- No residue after rework and easy cleaning.
Usage:
This flux can be used in both automated and manual soldering applications, it is great for general purpose soldering of electronic boards, wires, semiconductors and SMD/SMT/BGA.
It is also ideal for solder coating or tinning leads, it may be applied by spray, or foam for tin soldering applications.
Usage Recommendations:
- Clean the surface (Clear of any residues or dust).
- Put a little bit of flux.
- Use soldering iron with soldering wick.
- Use hot air soldering station for (SMT) ICs rework at (max180°C).
- Use thinner or any alcohol for cleaning.
Notes:
- Not suitable with dip or wave soldering.
- Not suitable with welding by fusion or flame.
Safety Precautions:
- Close after using & keep away from children.
- Use enough water when eyes or wounds are touched.
Appearance: The flux is a light yellow liquid, packaged in a transparent plastic bottle – (Net Capacity) 125mL.
Thanks for Your Trust
