For repairing (SMT/BGA) chipset solder balls, soldering and reballing of chipset for PCs, laptops, smartphones and all sensitive electronic components by using tin soldering iron, hot air soldering station and SMT/BGA rework station.
Features:
– Quick repairing of oxidized solder balls for chipset without lifting.
– Fast reflow and evenly spread under (BGA) chipset.
– High quality and activity.
– Non conductive, non corrosive and fungus resistant.
– No residue after rework and easy cleaning.
Usage:
This flux can be used in both automated and manual soldering applications, it is great for general purpose soldering of electronic boards, wires, semiconductors and SMD/SMT/BGA.
It is also deal for solder coating or tinning leads, it may be applied by spray, or foam for tin soldering applications.
Usage Recommendations:
– Clean the surface (Clear any residues or dust).
– Put a little bit of flux.
– Use soldering iron with soldering wick.
– Use hot air soldering station for (SMT) ICs rework at (max180°C).
– Use thinner or any alcohol for cleaning.
Notes:
– Not suitable with dip or wave soldering.
– Not suitable with welding by fusion or flame.
Safety Precautions:
– Close after using & keep away from children.
– Use enough water when eyes or wounds are touched.
Appearance: The flux is a light yellow liquid, packaged in a plastic bottle – (Net Capacity) 125mL.
Thanks for Your Trust
